PackPlus 2017 to host 375 exhibitors

 The exhibition will occupy six halls and for the first time an area of 16,000 sq/m will introduce a special Packaging Product pavilion with products such as specialised anti-counterfeit solutions, the latest in honeycomb packaging etc, will be showcased.

Besides the Packaging Product Pavilion, PackPlus will have six halls for primary packaging machinery, supply chain and converting.
The event is expected to see around 80 new product launches by Uflex Engineering, Modtech Machines, Bagla Group, MRL Printing Rolls, and Skytech Corporation among others.
Other prominent exhibitors include HP India, Ishida India, Hassia Packaging, Parle Global, SSP Packaging, Shrink Packaging, G-Tech Packaging Solutions, Orpac Systems, etc.
“With various product launches, running machines and solutions on display, PackPlus 2017 is all set for a record breaking year,” said Neetu Arora, president of

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